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Enhancing Signal and Power Integrity Using Double Sided Silicon Interposer

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3 Author(s)
Sridharan, V. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Swaminathan, M. ; Bandyopadhyay, T.

A novel double sided silicon interposer for low impedance power delivery is presented. In this letter, a model for power ground planes in inhomogeneous dielectrics with conductive subsections using the multi-layered finite difference method (M-FDM) is presented. Benefits of the silicon interposer in mitigating signal integrity issues arising due to return path discontinuities (RPDs) are also discussed for the first time along with a comparison to glass interposer.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:21 ,  Issue: 11 )