By Topic

Mechanism of Contact Resistance Reduction in Nickel Silicide Films by Pt Incorporation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Takeshi Sonehara ; Advanced Memory Development Center, Toshiba Corporation Semiconductor and Storage Products Company, Yokkaichi, Japan ; Akira Hokazono ; Haruko Akutsu ; Tomokazu Sasaki
more authors

Platinum (Pt) incorporation into nickel silicide (NiSi) films improves silicide characteristics such as lower contact resistance RC at silicide/Si interface and higher thermal stability. The impact of Pt incorporation is widely accepted and recognized in research field; however, the role of Pt in NiSi films has not been fully clarified so far. In this paper, the spatial distributions of Pt and dopants (i.e., arsenic and boron) in silicide films are studied at an atomic level analysis using local electrode atom probe. In particular, Pt and dopant distributions were investigated in detail both at silicide/Si interface and at silicide-grain boundary. Silicide-grain size was also analyzed at various Pt concentrations in silicide films, and the relationship between the Pt concentration and physical properties of Ni1-xPtxSi films is pointed out. Finally, for further CMOS device scaling, the benefit of higher concentration of Pt incorporation into Ni1-xPtxSi films is described.

Published in:

IEEE Transactions on Electron Devices  (Volume:58 ,  Issue: 11 )