By Topic

Improved Output Power of InGaN-Based Ultraviolet LEDs Using a Heavily Si-Doped GaN Insertion Layer Technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

13 Author(s)
Ching-Hsueh Chiu ; Department of Photonics and Institute of Electro-Optical Engineering, National Chiao Tung University, Hsinchu, Taiwan ; Chien-Chung Lin ; Po-Min Tu ; Shih-Cheng Huang
more authors

In this paper, a high quality ultraviolet light-emitting diodes (UV-LEDs) at 375 nm was developed using a heavy Si-doping technique with metal organic chemical vapor deposition. By using high-resolution X-ray diffraction, the full width at half-maximum of the rocking curve shows that the GaN film inserting a heavily Si-doped GaN layer (Si-HDL) had high crystalline quality. From the transmission electron microscopy image, the threading dislocation density was decreased after inserting a Si-HDL between undoped and n-doped GaN layers by nanoscale epitaxial lateral overgrowth. As a result, a much smaller reverse current and a higher light output were achieved. The improvement of light output at an injection current of 20 mA was enhanced by 40%. Therefore, we can use an in-situ nano pattern without complex photolithography and etching process and improve the internal quantum efficiency of UV-LEDs.

Published in:

IEEE Journal of Quantum Electronics  (Volume:48 ,  Issue: 2 )