Cart (Loading....) | Create Account
Close category search window
 

Experimental Validations of a Simple PCB Interconnect Model for High-Rate Signal Integrity

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Eudes, T. ; Grad. Sch. of Eng. ESIGELEC, IRSEEM (Res. Inst. on Electron. & Embedded Syst.), St. Etienne du Rouvray, France ; Ravelo, B. ; Louis, A.

This paper is devoted to investigating experimental validations of a simple modeling method of PCB interconnects for high-speed signal integrity and electromagnetic compatibility applications. Based on the theoretical approach using the extraction method of the interconnect per-unit-length RLCG parameters, the reduced models of the corresponding transfer function, -parameters, and access and transfer impedances are also established. The methodology describing the different steps of the technique proposed for practical use cases in ultra wideband is established. To verify the effectiveness of the concept under consideration, time-domain validations from the frequency-measured data are realized by using printed circuit board microstrip interconnect lines with micrometers width and millimeters long. Therefore, the model was first validated experimentally, and with electromagnetic simulations, in frequency domain via comparison of -parameters and -matrix from dc to some gigahertz. It was found that relative errors lower than 1 dB were evaluated between the insertion loss of the models, simulations, and measurements. Then, by injecting noisy digital- and mixed-signals with 1 Gigasymbol/s, relative errors of lower than 1% were evaluated by considering the time-domain responses. Compared to the existing interconnect modeling tools, the developed one presents a high accuracy, simplicity, and very less computation time.

Published in:

Electromagnetic Compatibility, IEEE Transactions on  (Volume:54 ,  Issue: 2 )

Date of Publication:

April 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.