By Topic

Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sturdivant, R. ; Radar & Commun. Sector, Hughes Aircraft Co., USA ; Chung Ly ; Benson, J. ; Wooldridge, J.

MMIC flip chips offer several benefits over conventional face-up versions. This includes lower cost, ease of interconnection, self alignment to motherboard, and simultaneous attachment and electrical connection. High power MMIC flip chips use bumps on the FET source to provide for an improved thermal path. When connected to a high thermal conductivity mounting substrate such as aluminum nitride, high power flip chips operate at lower temperatures than conventional flip chips. In fact, modeling has shown that they can have a 15/spl deg/C lower junction temperature compared to conventional MMICs. However, it is often desirable to use lower thermal conductivity mounting substrates such as LTCC. In these cases the junction temperate of a MMIC, flipped or face-up, can be too high for practical use. By using Chemical Vapor Deposition (CVD) diamond substrates, it is possible to reduce the junction temperature to acceptable levels. This work describes the uses of diamond with MMIC flip chips on low thermal conductivity substrates.

Published in:

Microwave Symposium Digest, 1997., IEEE MTT-S International  (Volume:2 )

Date of Conference:

8-13 June 1997