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When the Ag layer was introduced under the CoPt alloy film which annealed at 700°C, the CoPt/Ag films had large out-of-plane squareness (S⊥), out-of-plane coercivity (Hc⊥), and saturation magnetization (Ms). They were 0.95, 1432 kA/m, and 390 emu/cm3, respectively. Further, the SiNx ceramic materials were cosputtered with CoPt on the Ag underlayer at room temperature and then annealed to reduce the grain size of CoPt films. From the field-emission gun high-resolution transmission electron microscope analysis, the particle size of CoPt was about 10 nm as the SiNx content was 46.2 vol.%. Furthermore, Ag was added into the CoPt-SiNx films to reduce the transformation temperature of CoPt films from face-centered-cubic to face-centered-tetragonal structure.