Cart (Loading....) | Create Account
Close category search window
 

Nondestructive Evaluation of Austenitic Stainless Steel Using CIC-MFL and LIHaS

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Jongwoo Jun ; Res. Center for Real Time NDT, Chosun Univ., Gwangju, South Korea ; Myungki Choi ; Jinyi Lee

Austenitic stainless steels (A-SS) are extensively used in widespread industrial and technological applications due to their good corrosion resistance combined with their relatively high strength, toughness, and stiffness. However, sometimes a small amount of partial magnetization is generated in A-SS due to imperfect final heat treatments and mechanical processing, such as rolling and welding. These partially magnetized regions may be misidentified as a crack when tested using conventional nondestructive methods. This paper presents a nondestructive evaluation approach using a linearly integrated Hall sensor array (LIHaS) and a combined induced current and magnetic flux leakage (CIC-MFL) method in order to ensure reliable crack inspections for A-SS.

Published in:

Magnetics, IEEE Transactions on  (Volume:47 ,  Issue: 10 )

Date of Publication:

Oct. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.