By Topic

Temperature profile optimization for silicon-polymer electrothermal microgripper

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Huu, P.P. ; Univ. of Eng. & Technol., Hanoi, Vietnam ; Duc, T.C.

This paper presents design and simulation on optimizing a sensing microgripper structure based on silicon-polymer electrothermal actuators and piezoresistive force-sensing cantilever beams. The simulation is to utilize the structure and organize heaters for lower temperature at gripper's jaw, while not affecting the displacement. By reducing the heat diffusion into the base and the redistribution of heat sources for silicon combs of the actuator, the temperature profile of this microgripper has been improved considerably. The result is 63% reduction of operating temperature (from a maximum of 200 °C was reduced to 74 °C) and power consumption is also reduced by 50%.

Published in:

Advanced Technologies for Communications (ATC), 2011 International Conference on

Date of Conference:

2-4 Aug. 2011