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Biomaterials as bonding wires for integrated circuit nanopackaging

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4 Author(s)
Weigel-Jech, M. ; Div. Microrobotics & Control Eng., Univ. of Oldenburg, Oldenburg, Germany ; Bartenwerfer, M. ; Mikczinski, M. ; Fatikow, S.

Today's miniaturization of integrated circuits for MEMS and NEMS systems depends strongly on the limitations of integrated circuit packaging. The integration of biomaterials as nano bonding wires may result in an improvement of the properties of such systems up to the development of novel innovative systems. That implies that currently missing methods and techniques have to be developed to enable an industrial feasible handling, manipulating and characterizing of such biomaterials. So the main objectives have to be the development methods which are fully automatable, fast, reliable, robust to environmental changes as well as useable at a dry environment of clean room facilities or the vacuum environment of SEM chambers. According to this, the target of the presented efforts is to develop such methods for a usage of biomaterials to solve packaging problems at the nanoscale. This paper presents a novel concept and first experimental results of the handling of cellulose fibers as well as DNA wires, for an automatable handling and characterization of such bio nano bonding wires. Methods for the handling and characterization of cellulose fibers in the SEM will be presented as well as DNA-handling methods with an AFM at dry conditions, which can also be used in the vacuum chamber.

Published in:

Advanced Intelligent Mechatronics (AIM), 2011 IEEE/ASME International Conference on

Date of Conference:

3-7 July 2011