By Topic

A wideband body-enabled millimeter-wave transceiver for wireless Network-on-Chip

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Xinmin Yu ; Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA ; Suman Prasad Sah ; Sujay Deb ; Partha Pratim Pande
more authors

A highly energy-efficient on-chip communication network is crucial for the development of future multi-core chips. In this paper, a wideband millimeter-wave (mm-wave) transceiver was designed for the wireless Network-on-Chip (WiNoC) architecture. In order to reduce the power consumption of the transceiver, body-enabled circuit design techniques were implemented: Forward body-bias was used in the low-noise amplifier (LNA) and power amplifier (PA) circuits to lower the threshold voltages, reducing the supply voltage to 0.8 V. For up-and down-conversion mixers, power-hungry transconductance stages were eliminated by feeding the signals directly into the body terminals of the transistors. In addition, a novel feed-forward structure was designed to extend the bandwidth of the LNA at no cost in power consumption. Simulation results showed that the receiver has a double-sideband noise figure of less than 6 dB, and a peak gain of 20.5 dB, while the transmitter has an output P1dB of 0 dBm. The transceiver achieved an overall 3-dB bandwidth of 18 GHz. Compared with our previous design without body-enabled design techniques, the receiver power consumption was reduced by 20.3%.

Published in:

2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS)

Date of Conference:

7-10 Aug. 2011