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Wrapper design of embedded cores for three dimensional system-on-chips (SoC) using available TSVs

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4 Author(s)
Roy, S.K. ; Dept. of Inf. Technol., Bengal Eng. & Sci. Univ., Shibpur, India ; Giri, C. ; Ghosh, S. ; Rahaman, H.

Core based three-dimensional(3D) integrated circuits (ICs) design is an emerging field of semiconductor industry that promises greater number of devices on chip, increased performance and reduced power consumption. But due to scaling in technology features these chips are more complex and hence testing of these 3D ICs is a challenging task. This paper follows a P1500-style wrapper design for 3D ICs using through silicon vias (TSVs) for testing purpose. It is assumed that the core elements are distributed over several layers of the ICs. As the number of available TSVs are limited due to small chip area, this work is intended to design balanced wrapper chains using available TSVs. In this work we have proposed a polynomial time algorithm of O(N) to design the test wrapper. The results are presented based on the ITC'02 SOC test benchmarks and compared with prior work. Obtained results show that our algorithm provides better utilization of TSVs compared to the work presented in [1].

Published in:

Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on

Date of Conference:

7-10 Aug. 2011