Low Profile Fully Planar Folded Dipole Antenna on a High Impedance Surface

A fully planar antenna design incorporating a high impedance surface (HIS) is presented. The HIS is composed by a periodic array of subwavelength dogbone-shaped conductors printed on top of a thin dielectric substrate and backed by a metallic ground plane. First, the characteristics of a dipole over PEC or PMC layers, a dielectric slab, and the HIS are compared and studied in detail, highlighting the advantages provided by the use of the HIS. Then, the design of a low profile folded dipole antenna working at 5.5 GHz on top of the HIS is described. The surface provides close to 6% antenna impedance bandwidth and increased gain up to 7 dBi, while shielding the lower half space from radiation. The antenna structure comprises three metal layers without any vias between them, and its overall thickness is 0.059λ
₀
. The dipole is fed by a balanced twin lead line through a balun transformer integrated in the same antenna layer. A prototype has been built and measurements confirming simulation results are provided.