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This study demonstrates a novel tunable quality factor, self-assembly inductor and packaging using an alternating magnetic flux. The merit of the design is to tilt the inductor from the lossy substrate and localize welding for assembly simultaneously using the magnetic film. A localized induction heating approach by an embedded heater was presented to prevent thermal problems during bonding. To demonstrate the feasibility of the proposed concept, the 8-turn of meander strip inductor was fabricated using MEMS technology. The radio frequency (RF) performance of the inductor at various tilting angles away from the substrate (0° and 90°) was characterized by using a two-port vector network analyzer. Typical measurement results indicate that the inductor is bonded with a good strength (403 g) and the quality factor (Q) can be controlled within 2.9 ~ 5.2 by assembly.
Date of Conference: 20-23 Feb. 2011