Cart (Loading....) | Create Account
Close category search window
 

Conduction current behavior during electrophoretic deposition of conductive polymer

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Onoda, Mitsuyoshi ; Dept. of Electr. Eng. an Comput. Sci., Univ. of Hyogo, Himeji, Japan ; Tada, Kazuya

The electrical conduction current behavior during electrophoretic deposition of a fluorene-based conductive polymer, poly(9,9-dioctyl-2, 7-divinylenefloure nylene)-alt-{2-methoxy-5-(2-ethylhexyloxy)-1, 4-phenylene}], (PDOF-MEHPV), has been studied. Thin slab vessels provide a simple path for the colloidal particles during deposition as well as minimum suspension consumption, and the transient current behavior during the electrophoretic deposition from a suspension containing 1.0 g/l of the polymer in those vessels reveal clear breaks corresponding to the transit time. The electrophoretic mobility of the colloidal particles in the suspension has been estimated to be 7.0±0.6×10- cm2V-1s-1. The deposition of a uniform film of the polymer over a 9cm-square utilizing the thin slab vessel has also been demonstrated.

Published in:

Dielectric Liquids (ICDL), 2011 IEEE International Conference on

Date of Conference:

26-30 June 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.