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The design of a novel embedded motion controller in simple automatic die-bonding system

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4 Author(s)
Zhai Wen-zheng ; Sch. of Math. & Inf. Eng., Taizhou Univ., Taizhou, China ; Guan Gong-hu ; Zhang Hai-bo ; Sun Qiao-ping

This paper presents a novel embedded motion controller in a high precision simple automatic thyristor module die bonder against tradition PCI card based motion controller. Based on the analysis of die-bonding system structure and operation principle, a solution of 4-axes motion controller integrated with ARM Cortex-M3 microprocessor and special DSP motion control microchip is put forward. After the hardware architecture design and software programming are completed, the embedded motion controller meets the control accuracy, real-time and reliability in simple automatic die-bonding system. The innovative design not only improves product quality and production efficiency, but also reduces production costs. The controller is practical and can be widely applied in the field of industrial control.

Published in:

Intelligent Control and Information Processing (ICICIP), 2011 2nd International Conference on  (Volume:2 )

Date of Conference:

25-28 July 2011