Cart (Loading....) | Create Account
Close category search window
 

Piezoelectric MEMS Energy Harvester for Low-Frequency Vibrations With Wideband Operation Range and Steadily Increased Output Power

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Huicong Liu ; Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore, Singapore ; Cho Jui Tay ; Chenggen Quan ; Kobayashi, T.
more authors

A piezoelectric MEMS energy harvester (EH) with low resonant frequency and wide operation bandwidth was designed, microfabricated, and characterized. The MEMS piezoelectric energy harvesting cantilever consists of a silicon beam integrated with piezoelectric thin film (PZT) elements parallel-arranged on top and a silicon proof mass resulting in a low resonant frequency of 36 Hz. The whole chip was assembled onto a metal carrier with a limited spacer such that the operation frequency bandwidth can be widened to 17 Hz at the input acceleration of 1.0 g during frequency up-sweep. Load voltage and power generation for different numbers of PZT elements in series and in parallel connections were compared and discussed based on experimental and simulation results. Moreover, the EH device has a wideband and steadily increased power generation from 19.4 nW to 51.3 nW within the operation frequency bandwidth ranging from 30 Hz to 47 Hz at 1.0 g. Based on theoretical estimation, a potential output power of 0.53 μW could be harvested from low and irregular frequency vibrations by adjusting the PZT pattern and spacer thickness to achieve an optimal design.

Published in:

Microelectromechanical Systems, Journal of  (Volume:20 ,  Issue: 5 )

Date of Publication:

Oct. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.