By Topic

Measurements of Multimodal Approach to Haptic Interaction in Second Life Interpersonal Communication System

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hossain, S.K.A. ; Multimedia Commun. Res. Lab. (MCRLab), Univ. of Ottawa, Ottawa, ON, Canada ; Rahman, A.S.M.M. ; El Saddik, A.

The sense of touch has much importance in technology-mediated human emotion communication and interaction. Many researchers around the world are aiming to leverage the sense of touch in the communication medium between multiuser 3-D virtual world and real environment. Driven by the motivation, we explored the possibilities of integrating haptic interactions with Linden Lab's multiuser online virtual world, Second Life. We enhanced the open source Second Life viewer client in order to facilitate the communications of emotional feedbacks such as human touch, encouraging pat, and comforting hug to the participating users through real-world haptic stimulation. These emotional feedbacks that are fundamental to physical and emotional development in turn can enhance the users interactive and immersive experiences with the virtual social communities in the Second Life. In this paper, we describe the development of a prototype that realizes the aforementioned virtual-real communication through a haptic-jacket system. Some of the potential applications of the proposed approach includes distant lover's communication, remote child caring, and stress recovery.

Published in:

Instrumentation and Measurement, IEEE Transactions on  (Volume:60 ,  Issue: 11 )