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Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling

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3 Author(s)
Mizunuma, H. ; Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Yi-Chang Lu ; Chia-Lin Yang

Integrated microchannel liquid-cooling technology is envisioned as a viable solution to alleviate an increasing thermal stress imposed by 3-D stacked ICs. Thermal modeling for microchannel cooling is challenging due to its complicated thermal-wake effect, a localized temperature wake phenomenon downstream of a heated source in the flow. This paper presents a fast and accurate thermal-wake aware thermal model for integrated microchannel 3-D ICs. A combination of the microchannel thermal-wake function and the channel merging technique achieves more than 3300× speedup with less than 5% error in comparison with a commercial numerical finite volume simulation tool. With the proposed model, we characterize thermal behaviors of microchannel-cooled 3-D ICs and compare them with the case of conventional air-cooled 3-D ICs. We also demonstrate thermal-aware placements using our thermal model. It shows that the proposed model can be used to reduce peak temperatures, which is considered important for 3-D IC designs.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:30 ,  Issue: 9 )

Date of Publication:

Sept. 2011

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