By Topic

Effect of conductor backing on the line-to-line coupling between parallel coplanar lines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Cheng, K.-K.M. ; Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong

A good estimate of the coupling effect between parallel coplanar waveguide (CPW) lines is important, especially for monolithic microwave integrated circuit (MMIC) applications where unnecessary crosstalk between conductors could be a serious problem. This paper shows how these coupling parameters may be analytically obtained in the presence of the back-face metallization. Closed-form formulas are developed for evaluating the quasi-TEM characteristic parameters based upon the conformal-mapping method (CMM). Very good agreement is observed between the values produced by these formulas and by a spectral-domain method (SDM)

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 7 )