By Topic

A Design Technique for Embedded Electromagnetic Band Gap Structure in Load Board Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Huh, S.L. ; Sch. of Electr. & Comput. Eng.- ing, Georgia Inst. of Technol., Atlanta, GA, USA ; Swaminathan, M.

A new design technique and analysis for an embedded electromagnetic bandgap (EBG) structure is presented. In modern multifunction designs, it may be required to integrate noise-sensitive analog circuits next to digital circuits. Here, digital switching noise can propagate through power/ground planes and affect analog circuit performance. It is important to block this effect. To prevent the noise propagation, an EBG-patterned power/ground plane can be an acceptable solution. However, difficulties arise when the EBG structure is put in a stripline-like environment; the embedded EBG structure loses the noise filtering function. The reason for the functional failure is analyzed, followed by a solution. The proposed solution has been demonstrated by both simulation and measurement. Simulation and measurement results demonstrate that the proposed embedded EBG structure can be effective for the desired noise isolation. The design technique is tested on a prototype load board for a 10-bit 3-GHz analog-to-digital converter from National Semiconductor. The suggested design technique for the embedded EBG structure includes three design parameters: 1) the potentials of the planes above and below the EBG layer; 2) the thicknesses of the dielectric layers above and below the EBG layer; and 3) the number and position of vias interconnecting the top and bottom planes.

Published in:

Electromagnetic Compatibility, IEEE Transactions on  (Volume:54 ,  Issue: 2 )