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3D integration for energy efficient system design

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1 Author(s)
Borkar, S. ; Intel Corp., Hillsboro, OR, USA

Technology scaling will continue, doubling transistor integration capacity every two years, providing billions of transistors to enable novel systems. 3D integration technology will open the doors even further, changing the landscape, allowing heterogeneous integration of diverse technologies, with abundance of energy efficient interconnects to realize affordable complex systems that will continue to deliver higher performance. This paper presents how to exploit this new technology for energy efficient system designs.

Published in:

Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE

Date of Conference:

5-9 June 2011