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Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

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5 Author(s)
Enayati, A. ; Inter-Univ. Micro-Electron. Center (IMEC), Leuven, Belgium ; Brebels, S. ; Vandenbosch, G.A.E. ; Deraedt, W.
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A cavity-backed antenna element is introduced and investigated for the antenna-in-package applications at 60GHz frequency band. A thin-film Silicon-based technology is used to implement the antenna element and two different configurations for 1×4 arrays of the same element. The feeding networks of the arrays are designed in such a manner that one of them has its main beam in the broad-side direction while the main beam of the second one is rotated to 45 degrees. Simulation and measurement results of return loss, radiation patterns and realized peak gains are compared.

Published in:

Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International

Date of Conference:

5-10 June 2011

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