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Parameters Variability Effects on Multiconductor Interconnects via Hermite Polynomial Chaos

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3 Author(s)
Stievano, I.S. ; Dipt. di Elettron., Politec. di Torino, Turin, Italy ; Manfredi, P. ; Canavero, F.G.

This paper focuses on the derivation of an enhanced transmission-line model allowing the stochastic analysis of a realistic multiconductor interconnect. The proposed model, which is based on the expansion of the well-known telegraph equations in terms of orthogonal polynomials, includes the variability of geometrical or material properties of the interconnect due to uncertainties like fabrication process or temperature. A real application example involving the frequency-domain analysis of a coupled microstrip and the computation of the parameters variability effects on the transmission-line response concludes this paper.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 8 )