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Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

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4 Author(s)
Yamamoto, S. ; Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan ; Higurashi, E. ; Suga, T. ; Sawada, R.

For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150°C).

Published in:

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Date of Conference:

5-9 June 2011