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Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps

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5 Author(s)
Antelius, M. ; KTH R. Inst. of Technol., Stockholm, Sweden ; Fischer, A.C. ; Roxhed, N. ; Stemme, G.
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This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.

Published in:
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Date of Conference: 5-9 June 2011

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