By Topic

Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)

This study reports a CMOS-MEMS condenser microphone implemented using the standard thin films stacking of 0.35μm UMC CMOS 3.3/5.0V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, silicon substrate is employed to increase the stiffness of back-plate. Measurements show the sensitivity of microphone is -42±3dBV/Pa at 1kHz under 6V pumping voltage, the frequency response is 100Hz-10kHz, and the S/N ratio >;55dB. Table1 summarizes detail specifications.

Published in:

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Date of Conference:

5-9 June 2011