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A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

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3 Author(s)
Liao, Y.-T. ; Electr. Eng. Dept., Univ. of Washington, Seattle, WA, USA ; Shi, J. ; Otis, B.

This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

Published in:

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Date of Conference:

5-9 June 2011

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