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Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

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11 Author(s)
Daito, M. ; Assoc. of Super-Adv. Electron. Technol. (ASET), Yokohama, Japan ; Nakata, Y. ; Sasaki, S. ; Gomyo, H.
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A capacitively coupled probing circuit with a novel de-skewer, a low-pass filter and a high-sensitivity receiver is proposed to realize a membrane-based wafer-level simultaneous testing robustly. The de-skewer can be designed by only digital core transistors and has stable feed-forward architecture. The receiver with the low-pass filter can suppress the undesirable ringing caused by the complex wiring structure in the probe card. A probe chip and a 300 mm DUT-wafer are fabricated in a 1.2 V 90 nm technology and the measured power consumption of RX core is 0.5 mW at 1 Gbps operation. The BER is improved below 10-12 over almost all UI range when the de-skewing function is turned on.

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Solid-State Circuits, IEEE Journal of  (Volume:46 ,  Issue: 10 )