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Validation by Measurements of an IC Modeling Approach for SiP Applications

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9 Author(s)
Cunha, T.R. ; Dept. of Electron., Telecommun. & Inf., Univ. of Aveiro, Aveiro, Portugal ; Teixeira, H.M. ; Pedro, J.C. ; Stievano, I.S.
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The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern system-in-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple measurement procedures. This paper presents the contribution for the establishment of an integrated IC modeling approach whose performance is assessed by direct comparison with the signals measured in laboratory of two distinct memory IC devices. Based on the identification of the main blocks of a typical IC device, the modeling approach consists of a network of system-level sub-models, some of which with already demonstrated accuracy, which simulated the IC interfacing behavior. Emphasis is given to the procedures that were developed to validate by means of laboratory measurements (and not by comparison with circuit-level simulations) the model performance, which is a novel and important aspect that should be considered in the design of IC models that are useful for SI analysis.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 8 )