By Topic

Roll-to-Roll Processing of Flexible Heterogeneous Electronics With Low Interfacial Residual Stress

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
YongAn Huang ; State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China ; Jiankui Chen ; Zhouping Yin ; Youlun Xiong

The roll-to-roll (R2R) processing plays an increasingly important role in the high-throughput fabrication of flexible electronics. This paper highlights the dramatic influence of material properties, geometrical dimensions of film-on-substrate structure, process temperatures, and web tension of the R2R processing. A co-optimization approach has been presented for the R2R processing, and all the design and process parameters are to be simultaneously optimized to reduce the interfacial residual stress. First, the misfit strain between the thin film and the substrate is established based on the process parameters. The temperature-dependent properties are involved in polymer/rubber substrate. Nonlinear phenomena are discovered when the process temperatures and the web tension are involved in substrate together. Then, the interfacial shear and peeling stresses resulted from R2R processing are derived in analytical model based on the generalized plane strain theory. The interfacial stresses are related with process temperatures, material properties, and structural dimensions. Finally, a multivariable optimization model is established to compensate the misfit strain. The results imply that device structures and process parameters are correlated phenomena and therefore should be simultaneously optimized in the R2R processing of flexible electronics.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 9 )