Cart (Loading....) | Create Account
Close category search window
 

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
De-Shin Liu ; Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan ; Chi-Min Chang ; Chin-Yi Tu ; An-Hong Liu
more authors

Wafer testing in the semiconductor industry is generally performed using a multilayer probe card. In this paper, Castigliano's second theorem is used to derive analytical formulae for the contact force and scrub mark length generated during the probing test. The formulations are then integrated with a multiobjective programming algorithm to optimize the probe needle parameters in such a way as to ensure a uniform contact force and a minimum scrub mark length. The validity of the analytical model is confirmed by comparing the solutions obtained for the contact force and scrub mark length with the equivalent results obtained from finite element simulations. The effectiveness of the analytical model and optimization procedure is demonstrated by optimizing the needle parameters of a commercial four-layer probe card. It is shown that the optimized probe card not only produces a more uniform contact force than the original probe card but also yields a shorter and more uniform scrub mark length.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 8 )

Date of Publication:

Aug. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.