By Topic

Hardware Error Likelihood Induced by the Operation of Software

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Bing Huang ; Everspin Technol. Inc., Chandler, AZ, USA ; Rodriguez, M. ; Ming Li ; Bernstein, J.B.
more authors

The influence of the software, and its interaction and interdependency with the hardware in the creation and propagation of hardware failures, are usually neglected in reliability analyses of safety critical systems. The software operation is responsible for the usage of semiconductor devices along the system lifetime. This usage consists of voltage changes and current flows that steadily degrade the materials of circuit devices until the degradation becomes permanent, and the device can no longer perform its intended function. At the circuit level, these failures manifest as stuck-at values, signal delays, or circuit functional changes. These failures are permanent in nature. Due to the extremely high scaling of complementary metal-oxide-semiconductor (CMOS) technology into deep submicron regimes, permanent hardware failures are a key concern, and can no longer be neglected compared to transient failures in radiation-intense applications. Our work proposes a methodology for the reliability analysis of permanent failure manifestations of hardware devices due to the usage induced by the execution of embedded software applications. The methodology is illustrated with a case study based on a safety critical application.

Published in:

Reliability, IEEE Transactions on  (Volume:60 ,  Issue: 3 )