Notification:
We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Performance comparison between single wall carbon nanotube bundle and multiwall carbon nanotube for global interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Majumder, M.K. ; Dept. of Electron. & Comput. Eng., Indian Inst. of Technol.-Roorkee, Roorkee, India ; Kaushik, B.K. ; Manhas, S.K.

Multi-wall carbon nanotubes (MWNTs) have potentially provided an attractive solution over single-wall carbon nanotube (SWNT) bundles at deep sub-micron level very large scale integration (VLSI) technologies. This paper presents a comprehensive analysis of propagation delay for both MWNT and SWNT bundles at different interconnect lengths (global) and shows a comparison of area for equivalent number of SWNTs in bundle and shells in MWNTs. It has been observed that irrespective of the type of CNTs, propagation delay increases with interconnect lengths. For same propagation delay performance, the area occupied by SWNT bundle is more than the MWNTs for a specified interconnect length.

Published in:

Emerging Trends in Networks and Computer Communications (ETNCC), 2011 International Conference on

Date of Conference:

22-24 April 2011