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Multi-wall carbon nanotubes (MWNTs) have potentially provided an attractive solution over single-wall carbon nanotube (SWNT) bundles at deep sub-micron level very large scale integration (VLSI) technologies. This paper presents a comprehensive analysis of propagation delay for both MWNT and SWNT bundles at different interconnect lengths (global) and shows a comparison of area for equivalent number of SWNTs in bundle and shells in MWNTs. It has been observed that irrespective of the type of CNTs, propagation delay increases with interconnect lengths. For same propagation delay performance, the area occupied by SWNT bundle is more than the MWNTs for a specified interconnect length.