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Three-Dimensional Stacked Multilayer Graphene Interconnects

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5 Author(s)
Tianhua Yu ; Novellus Systems, Inc., San Jose, USA ; Chen-Wei Liang ; Changdong Kim ; Eui-Sang Song
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We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers.

Published in:

IEEE Electron Device Letters  (Volume:32 ,  Issue: 8 )