Referenced Items are not available for this document.
Power management relieves critical bottlenecks in saving electrical energy and efficient switching devices are particularly required for synchronous power conversion module. To optimize both switching and thermal efficiencies for convertor configuration it relies on the advanced package technology. An analysis has been undertaken in this work to identify the challenge on power electronic packages to ensure the system efficiencies continue to increase. This paper presents an innovative three-dimension (3D) packaging technology - CoolPAK, which enables high voltage, high frequency and high reliable voltage switching with reduced power loss in thermal dissipation.
Published in:
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
(Volume:2
)
Date of Conference: 10-12 June 2011
- Page(s):
- 293 - 296
- Print ISBN:
- 978-1-4244-8727-1
- INSPEC Accession Number:
- 12121503
- Conference Location :
- Shanghai
- Digital Object Identifier :
- 10.1109/CSAE.2011.5952473
- Product Type:
- Conference Publications
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