Cart (Loading....) | Create Account
Close category search window

Current-Charge-Pump Residue Amplification for Ultra-Low-Power Pipelined ADCs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Junhua Shen ; Columbia Univ., New York, NY, USA ; Kinget, P.R.

A low-power multiplying digital-to-analog conversion (MDAC) circuit realization using a current-charge-pump (CCP) residue amplifier is presented. It takes advantage of the improved timing resolution in advanced CMOS technologies by transforming the voltage signal into an equivalent time-domain representation. The proposed CCP MDAC only uses switches, current sources, capacitors, and a comparator. It occupies a small area and achieves high power efficiency by eliminating operational transconductance amplifiers for the interstage amplification and by avoiding power-hungry buffers for the reference voltages. The CCP amplifier principle is demonstrated in a 1-V 100-MS/s 8-bit CCP pipelined analog-to-digital conversion proof-of-concept prototype in a 90-nm CMOS.

Published in:

Circuits and Systems II: Express Briefs, IEEE Transactions on  (Volume:58 ,  Issue: 7 )

Date of Publication:

July 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.