By Topic

Research on thermal characteristics and on-chip temperature-controlling for silicon micro-gyroscope

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Lu Xu ; Key Laboratory of Micro Inertial Instrument and Advanced Navigation Technology of Ministry of Education, Southeast University, Nanjing 210096, China ; Bo Yang ; Shourong Wang ; Hongsheng Li
more authors

This paper presents a novel gyroscope prototype with on-chip heater and temperature sensor to keep gyroscope uninfluenced by environmental temperature. It firstly introduced the gyroscope's working principle and deduced its temperature dependence to get performances' temperature sensitivity. It turns out capacitive sensitivity has a variation of 13.5 % when gyroscope's working temperature has a change of 50 K. Then the gyroscope prototype with on-chip temperature-controlling was given and its performances were analyzed theoretically and numerically. Besides, fabrication process was designed based on Silicon-On-Glass (SOG) technology. Simulation results indicate that, to keep gyroscope's temperature at 60°C with a temperature difference between center mass and anchor below 1.6°C, the power consumption increases from 0.011 W to 0.213 W when environmental temperature decreases from 55°C to -40°C. When environmental temperature is 20°C and consumption power is 0.0884 W, gyroscope can reach its equilibrium state of 60°C from 20°C within 20s. Stress intensities inside gyroscope are less than the ultimate tensile or compressive strength of each material. It theoretically proves that the prototype meets the three demands of low power consumption, even temperature distribution and quick thermal response. Hopefully, the prototype can be manufactured and tested in the future.

Published in:

Information and Automation (ICIA), 2011 IEEE International Conference on

Date of Conference:

6-8 June 2011