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Modeling of High-Speed Interconnects for Signal Integrity Analysis?? Part I

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1 Author(s)
Achar, R. ; Dept. of Electron., Carleton Univ., Ottawa, ON, Canada

Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed.

Published in:

Microwave Magazine, IEEE  (Volume:12 ,  Issue: 5 )