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Formation of electroless barrier for all-wet process of TSV in 3D-LSI technology and evaluation of its adhesion property

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8 Author(s)
Arima, R. ; Kansai Univ., Suita, Japan ; Inoue, F. ; Yokoyama, T. ; Miyake, H.
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The fabrication of thin barrier metal layer in a high aspect ratio TSV using electroless plating with Pd nanoparticles (NPs) as a catalyst was investigated. We succeeded in the formation of thin continuous electroless barrier metal layer for a high aspect ratio TSV with addition of adequate amount of additives. Adhesion strength of Co-W-B barrier metal increased with decreasing film thickness. The adhesion strength of barrier film increased with annealing at 200°C, and it was strong enough for practical application.

Published in:

Electron Devices, Kansai, (IMFEDK), 2011 International Meeting for Future of

Date of Conference:

19-20 May 2011

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