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Integrated test chips improve IC assembly

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1 Author(s)
J. N. Sweet ; Sandia Nat. Lab., Albuquerque, NM, USA

The use of test dies integrated with a semiconductor wafer to gauge environmental stresses effectively during the packaging and processing phases is discussed. These special-purpose assembly test chips (ATCs) are designed primarily for studying failures of the package-centered and composite types. These chips usually provide a way to stress the die, and they include transducers for monitoring the die's response to the stress. A variety of structures has been used to measure parameters associated with package-related failures. Corrosion detectors, moisture detectors, mechanical stress sensors, mobile ion sensors, thermal resistance measurement circuits, and multifunction test chips are examined.<>

Published in:

IEEE Circuits and Devices Magazine  (Volume:6 ,  Issue: 5 )