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Measurements, FEM simulation and spice modeling of a Thermal Conductivity Detector

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8 Author(s)
Rastrello, F. ; DIEI, Univ. of Perugia, Perugia, Italy ; Placidi, P. ; Scorzoni, A. ; Cozzani, E.
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In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%.

Published in:

Instrumentation and Measurement Technology Conference (I2MTC), 2011 IEEE

Date of Conference:

10-12 May 2011

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