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Electrical characterization of interconnects and materials for high speed computer packaging system

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4 Author(s)
Arabi, T. ; Intel Corp., Hillsboro, OR, USA ; Pomerleau, R. ; Jyh-Ming Jong ; Tripathi, V.K.

A technique for the wide band characterization of the interconnect losses in printed circuit boards is presented. The accuracy of the technique is enhanced by using time domain transformations to virtually eliminate the FFT associated errors. The de-embedding procedure applied in this paper is well suited to the wide band characterization of dielectric materials in a production like environment. The usefulness and accuracy of the approach is demonstrated by measurements

Published in:

Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on

Date of Conference:

2-4 Nov 1994

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