Referenced Items are not available for this document.
Expectations of consumer for future consumer electronics devices put significant strain on conventional design and manufacturing processes. Integrating more functionality in a smaller form factor with lower power consumption and cost is pushing traditional semiconductor technology scaling to its limits. Three dimensional chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. This paper outlines a generic methodology to design 3D systems.
Published in:
Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
Date of Conference: 15-18 May 2011
- Page(s):
- 2229 - 2232
- ISSN :
- 0271-4302
- E-ISBN :
- 978-1-4244-9472-9
- Print ISBN:
- 978-1-4244-9473-6
- INSPEC Accession Number:
- 12436238
- Conference Location :
- Rio de Janeiro
- Digital Object Identifier :
- 10.1109/ISCAS.2011.5938044
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
