Scheduled System Maintenance:
On Wednesday, July 29th, IEEE Xplore will undergo scheduled maintenance from 7:00-9:00 AM ET (11:00-13:00 UTC). During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Analysis of heat and fluid flow in a PCB channel using KAICUBE/Hanbit-1 parallel computer

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yun, B.T. ; Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Choi, D.H.

A 3D analysis code for mixed convection flow through the printed circuit board (PCB) channel on which heat-generating chip modules are mounted has been developed. For uniformly distributed modules, a small domain containing a single module is considered with periodic and symmetric boundary conditions. Calculations have been made for various Grashof numbers to examine the effects of natural convection for both adiabatic and conducting wall conditions. The program is designed to run on the KAICUBE/Hanbit-1 parallel computer, and its performance on different machines is compared in this paper

Published in:

High Performance Computing on the Information Superhighway, 1997. HPC Asia '97

Date of Conference:

28 Apr-2 May 1997