The first fabrication and RF characterisation of an InGaP/GaAs double heterojunction bipolar transistor in collector-up configuration is reported. Boron implantation is used to avoid electron injection into the extrinsic base regions. The InGaP collector offers fmax=115 GHz and a high breakdown voltage (BVceo=27V)
Published in:
Electronics Letters
(Volume:33
,
Issue:
7
)
Date of Publication: 27 Mar 1997