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This work presents an investigation of interfacial interaction between an industrial grade epoxy molding compound and a native silicon dioxide layer usually found at chip surfaces. The free surfaces of both solid materials were subjected to an experimental contact angle analysis of three different liquids (water, diiodomethane and glycerol). Results are compared to interaction energies found by analysis of molecular models of the interfaces, yielding reasonable agreement. Results of the simulation furthermore allow a qualitative prediction about the influence of water at the interface between chip and molding compound.