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Electromigration studies of lead-free solder balls used for wafer-level packaging

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6 Author(s)
Hau-Riege, C. ; Qualcomm, Santa Clara, CA, USA ; Zang, R. ; You-Wen Yau ; Yadav, P.
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Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.

Published in:

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Date of Conference:

May 31 2011-June 3 2011