By Topic

Temperature dependence of mechanical properties of isotropic conductive adhesive filled with metal coated polymer spheres

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Hoang-Vu Nguyen ; Dept. of Micro & Nano Syst. Technol., HiVe-Vestfold Univ. Coll., Borre, Norway ; Kristiansen, H. ; Johannessen, R. ; Andreassen, E.
more authors

An isotropic conductive adhesive (ICA) filled with metal-coated polymer spheres (MPS) has been studied as a novel approach to increase the flexibility, and hence the reliability, compared to the conventional metal-filled ICA. In this study, the effect of the metal coating on the die shear strength was investigated by comparing ICA materials with coated and uncoated polymer spheres. The other important part of the study was to assess the temperature dependence of the die shear strength of an MPS-based ICA, and also compare this with the behavior of a conventional ICA filled with Ag particles. The results showed that the metal coating does not have a critical effect on the die shear strength of ICA filled with MPS. The die shear strengths obtained for the MPS-based ICA and the conventional Ag-filled ICA have the same temperature dependence in the range of 20°C to 120°C. Furthermore, none of the ICA systems has experienced a critical drop in die shear strength at and above the glass transition temperature.

Published in:

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Date of Conference:

May 31 2011-June 3 2011