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Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor

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8 Author(s)
Gawon Kim ; Amkor Technol. Korea, Seoul, South Korea ; SeungJae Lee ; Jiheon Yu ; GyuIck Jung
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In this paper, coreless flip-chip BGA in Amkor Technology will be introduced with two options. First option is a revised coreless substrate design with layer reduction from original core substrate design of flip-chip BGA package and the second one is the coreless substrate with high dielectric constant thin film embedded decoupling capacitor in order to improve power integrity performance. The coreless substrate was redesigned to reduce the number of layers for low-cost solution. Since the original core substrate has 12 layers (4-4-4) and the revised coreless substrate has 9 layers (8+1), the cost of flip-chip BGA substrate could be reduced. Coreless substrates will use ABF films and high dielectric constant thin film to replace core and prepreg dielectric materials and to form embedded decoupling capacitor between power/ground planes.

Published in:

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Date of Conference:

May 31 2011-June 3 2011