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Non-contact handling and transportation for substrates and microassembly using ultrasound-air-film-technology

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7 Author(s)
Reinhart, G. ; Inst. for Machine Tools & Ind. Manage., Tech. Univ. Munchen, Munich, Germany ; Heinz, M. ; Stock, J. ; Zimmermann, J.
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The requirements needing to be met by handling technologies and factory automation in semiconductor fabrication and microsystem s technology are rising relentlessly. Fragile, surface-sensitive and thinned substrates call for new, innovative approaches in order to tackle numerous material handling tasks. Therefore a new upcoming handling technology based on the ultrasound-air-film-technology and its applications for non-contact handling in PV-Thin-Film and microassembly are presented in this paper.

Published in:
Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI

Date of Conference: 16-18 May 2011

Page(s):
1 - 6
ISSN :
1078-8743
E-ISBN :
978-1-61284-409-1
Print ISBN:
978-1-61284-408-4
INSPEC Accession Number:
12071580
Conference Location :
Saratoga Springs, NY
Digital Object Identifier :
10.1109/ASMC.2011.5898208
Product Type:
Conference Publications

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