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The requirements needing to be met by handling technologies and factory automation in semiconductor fabrication and microsystem s technology are rising relentlessly. Fragile, surface-sensitive and thinned substrates call for new, innovative approaches in order to tackle numerous material handling tasks. Therefore a new upcoming handling technology based on the ultrasound-air-film-technology and its applications for non-contact handling in PV-Thin-Film and microassembly are presented in this paper.
Date of Conference: 16-18 May 2011